Endoscope Module Development Trends

Kev pov tseg: Cov khoom pov tseg tag nrho siab -cov lus txhais endoscopes (xws li qee cov khoom lag luam los ntawm Ambu thiab Olympus), tsav tsheb qis - nqi, kev ntim khoom siv tshuab.

Siab-Txhais tau thiab txawj ntse: Kev sib koom ua ke 4K, 3D, thiab NBI kev ua haujlwm, embedding AI edge computing units (NPU) rau tiag tiag- lub sijhawm ntsuas duab.

Miniaturization thiab Flexibility: Breakthroughs nyob rau hauv module txoj kab uas hla mus rau<2mm, enhancing active bending capabilities (suitable for ultra-fine fields such as neurology and ENT).

Kev tsim kho tshiab: 3D ntim, wafer-theem optics (WLO), lensless imaging nrog MEMS scanning iav, optoelectronic co- ntim (tsis muaj jumper xaim teeb liab).

Cov Khoom Siv Tshiab thiab Cov Txheej Txheem: Siab-kev ua haujlwm kho mob nplaum, siab - cov ntaub ntawv xa tawm qhov rais, AI- pab kom muaj kev sib raug zoo (kev txhim kho kev tsim khoom thiab tawm los).